COB DISPLAY TECHNOLOGY

COB (Chip-on-Board) is a next-generation LED display technology that directly bonds LED chips onto the circuit board—eliminating traditional packaging and enabling higher pixel density. Ideal for large-format, seamless displays, COB offers exceptional durability, brightness, and viewing consistency.

📌 How It Works
In COB displays, multiple LED chips are mounted directly onto a substrate as a single lighting module. This compact arrangement allows for ultra-fine pixel pitches and seamless visual integration, especially in large-scale video walls. The technology enhances thermal efficiency, impact resistance, and minimizes dead pixel risk.

📈 Key Advantages

• Seamless Image Output: Supports ultra-fine pitch with no visible gaps between modules
• Enhanced Durability: Anti-collision, dustproof, and moisture-resistant surface design
• High Brightness & Uniformity: Offers consistent brightness and color across large surfaces
• Compact Design: Reduces component volume and enables thinner, lighter screens
• Versatile Installation: Suitable for curved, flexible, and custom-shaped displays

🖥 Application Scenarios

• Indoor and outdoor LED video walls
• Command centers and control rooms
• Airports, stadiums, and transportation hubs
• Luxury retail, exhibition, and showroom environments

By simplifying LED packaging and enhancing display integrity, COB technology enables robust, high-resolution visual experiences—especially for commercial, high-traffic, or precision-demanding environments.